MID, glass-, ceramic-boards - BIZON-WICON connecting technique

Go to content

3D-MID are spatial, i.e. three-dimensional printed circuit boards.
So, a functional part made of plastic can assume electric functions.
For this reason, the press-fit technology is of course interesting in MID elements.

However, the base material at MID's differs fundamentally from FR4 on PCBs.
Not just any press-fit contact is suitable.

Normally thermoplastics are softer than FR4, so the force of the contact must be adjusted.
Not every press-fit pin which is approved for FR4 circuit boards can be used.

Ceramic and glass printed circuit boards are on the rise.
These notch-sensitive materials are a challenge for the press-in technology. The contact forces should be distributed as evenly as possible.

Any questions for applications? click here!

Back to content