3D-MID are spatial, i.e. three-dimensional printed circuit boards.
So, a functional part made of plastic can assume electric functions.
So, a functional part made of plastic can assume electric functions.
For this reason, the press-fit technology is of course interesting in MID elements.
However, the base material at MID's differs fundamentally from FR4 on PCBs.
Not just any press-fit contact is suitable. Normally thermoplastics are softer than FR4, so the force of the contact must be adjusted.
Not every press-fit pin which is approved for FR4 circuit boards can be used.
Ceramic and glass printed circuit boards are on the rise.
These notch-sensitive materials are a challenge for the press-in technology. The contact forces should be distributed as evenly as possible.
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